Electronic Adhesives Market held USD 3.6 billion in 2020 and is to grow with a CAGR of 4.3 % from 2020-2030. Electronic adhesives are used extensively in the design and assembly of electronic circuits and goods. Electronic adhesives are used for circuit safety and for various applications of electronic assembly such as bonding parts, wire tacking and electronic part encapsulation. These adhesives can also be used as coatings to protect the circuit board against harmful environmental factors such as corrosion, changes in temperature, and moisture which will likely to drive the global electronic adhesives market. Electronic adhesives may be differentiated, based on size, depending on the purpose. In a scanning electron microscope, for example, electrically conductive adhesives are used to ground the sample so as to reduce electrostatic surface charge.
Market Dynamics and Factors:
The electronics & electrical industry is expanding exponentially, with a wide range of uses. Printed circuit boards (PCBs) are an integral component of automotive, domestic, military, and industrial machinery, and need external environmental protection. Lack of security interferes with results, or at worst, leads to complete breakdown. Despite their excellent mechanical properties, electronics adhesives suit well in this case, which is a key factor to drive the global electronic adhesives market. Due to their wide range of applications in engine status indicators, collision avoidance systems, anti-theft systems, power electronic modules and LED packaging, increased product use in the automotive industry would cause growth in global electronic adhesive market.
Crucial market dynamics in global electronic adhesive markets, such as rising the number of product releases by vendors would also affect the growth of the market over the forecast period. In order to increase their sales flow and widen the customer base, many regional and international players are introducing new products. Additionally, new product releases help market vendors to gain a competitive advantage over their rivals. Several companies are releasing goods with electromagnetic compatible next-generation adhesives that can be used for electrical and electronic applications in the transportation, communications and consumer industries, which will result in growth of global electronic adhesives market. Many such vendor-led groundbreaking product launches are expected to fuel global electronic adhesives market growth.
Market Segmentation:
Based on the form of electric adhesive, the global electronic adhesives market is segmented into liquid, paste and solid. On the basis of type, the market is distributed into thermally conductive, UV curing electrically conductive and others. On the basis of application, the global electronic adhesives market is bifurcated into semiconductor & IC and printed circuit boards. Depending upon the geography, the market is classified into North America, Europe, Asia-Pacific, and RoW.
Geographic Analysis:
APAC has been predicted to account for the largest market share of electronic adhesives over the entire forecast period. Factors such as rapid industrialization, urbanization, increased disposable income and new construction activities have increased the region's demand for electronic adhesives, which will result in growth of global electronic adhesives market. In addition, growing geriatric population, developing middle-class population and increasing government spending in the medical sector are boosting the growth of APAC's electronic adhesives industry, thus contributing the overall growth of global electronic adhesives market.
Competitive Scenario:
The key players of global electronic adhesives market are 3M Company, KGaA, Dow Chemical, Henkel AG & Co., Kyocera Chemical Corp, HB Fuller, Dymax Corporation Creative Materials Inc. and Bondline Electronic Adhesives, Inc.
Electronic Adhesives Market Report Scope
Report Attribute | Details |
Analysis Period | 2020–2030 |
Base Year | 2021 |
Forecast Period | 2022–2030 |
Market Size Estimation | Billion (USD) |
Growth Rate (CAGR%) | 4.3 % |
| by Form (Liquid, Paste and Solid), by Type (Electrically Conductive, Thermally Conductive, UV Curing and Others), by Application (Printed Circuit Boards and Semiconductor & IC) |
Geographical Segmentation | North America (U.S., Canada, Mexico) Europe (UK, Germany, Italy, France, Rest of Europe), Asia-Pacific (China, Japan, India, Australia, Rest of APAC), South America (Brazil, Argentina, Rest of SA), MEA (UAE, Saudi Arabia, South Africa) |
Key Companies Profiled | 3M Company, KGaA, Dow Chemical, Henkel AG & Co., Kyocera Chemical Corp, HB Fuller, Dymax Corporation Creative Materials Inc. and Bondline Electronic Adhesives, Inc. |